Module thinning
Reorganize controller, battery, antenna, and interaction modules so an existing board can enter a thinner card or label form.
Product / Custom PCBA Cold Press
Custom Cold-Press Integration for Customer-Supplied PCBAs
Custom PCBA cold pressing serves customers with existing boards, modules, or core solutions, reorganizing the controller, battery, antenna, button, buzzer, display module, and surface layer into a thin card or label body.
The goal is to turn a working board into a manufacturable thin product. Yuli defines the process from component height, stack-up, adhesive filling, sound port, antenna, battery connection, surface finish, and test fixtures.
PCBAcustomer board
Cold pressingpotting and pressing
Fixtureproduction tests
OEM/ODMfinished product delivery
Customization Process
Custom PCBA cold pressing begins with stack-up.
When customer PCBA enters a cold-pressed structure, component height, antenna position, battery connection, button and acoustic openings, display window, edge sealing, and test points all affect final thickness and production stability.
Cold-pressed packaging
Use room-temperature potting, adhesive coverage, pressing, and edge sealing to protect sensitive parts and form a stable exterior.
Testing and shipment
Define pre-pressing tests, final functional tests, RF/acoustic/waterproofing tests, and outgoing criteria.
Key material for custom PCBA cold pressing.
PCBA size, component height, BOM, antenna position, battery specification, button and sound openings, display window, target thickness, finish, and volume determine feasibility and the prototype plan.
| Best for | Chip solution providers, module customers, brands, consumer electronics customers, vertical device makers |
|---|---|
| Product fit | Tracker cards, asset labels, identity cards, smart badges, embedded modules, custom thin devices |
| Related content | Advanced Cold Press · Cold-Press Process · RFQ |
Submit a custom PCBA cold-press brief.
Share PCBA drawings, component height, BOM, target thickness, module set, battery specification, antenna position, surface design, and expected volume.