Stack-up
Define the height relationship among PCBA, components, battery, and surface layers for thickness and edge stability.
Advanced Cold Press / PCBA Integration
Package electronic modules into thin card bodies.
PCBA cold-press integration serves projects with selected chipsets, modules, or customer boards, combining power, antenna, acoustics, display, button, and packaging into manufacturable thin hardware.
PCBA cold-press integration starts with the component stack and production requirements. Yuli checks component height, antenna clearance, battery connection, buzzer cavity, e-paper window, test points, and room-temperature potting.
PCBAcustomer board
Antennaclearance and direction
Acoustic chamberbuzzer cavity
Testingpre/post press tests
Integration Scope
Board, battery, antenna, and interaction parts enter one structure.
A thin smart card is not a board placed into a shell. Battery thickness, buzzer opening, button feel, e-paper protection, NFC/BLE antenna position, and test points reshape the card body.
Function protection
Room-temperature potting covers key areas, protects sensitive parts, and keeps space for acoustics, antenna, and display window.
Production tests
Define pre-pressing function tests, post-pressing RF/acoustic/display/power tests, and shipment consistency.
PCBA cold-press integration requirements
Share PCBA size, component height, BOM, antenna position, battery specification, target thickness, functions, appearance reference, and expected volume.