Stack-up
Define the height relationship among PCBA, components, battery, and surface layers for thickness and edge stability.
Advanced Cold Press / PCBA Integration
Cold-press integration for customer PCBAs, batteries, and antennas
For customer projects with an existing chipset, module, or solution board, Yuli reorganizes the PCBA, battery, antenna, buzzer, display, and button into a cold-pressed card structure for prototyping and production.
PCBA cold-lamination integration begins with stack-up and manufacturing constraints. Yuli checks component height, antenna clearance, battery connection, buzzer cavity, e-paper window, test points, and potting space before defining card thickness, the room-temperature pressing process, and finished-card validation.
PCBAcustomer board
Antennaclearance and direction
Acoustic chamberbuzzer cavity
Testingpre/post press tests
Integration Scope
A thin card body must accommodate the board, battery, antenna, and user interfaces.
In a thin smart card, battery thickness, buzzer openings, button feel, e-paper protection, NFC/BLE antenna position, and test points all consume structural space and must be designed together with the PCBA.
Function protection
Room-temperature potting covers key areas, protects sensitive parts, and keeps space for acoustics, antenna, and display window.
Production tests
Define pre-pressing function tests, post-pressing RF/acoustic/display/power tests, and shipment consistency.
Submit the customer PCBA and structural requirements
Share PCBA size, component height, BOM, antenna position, battery specification, target thickness, functions, appearance, validation requirements, and volume. Yuli will respond with feasibility, board-change recommendations, prototype scope, and production actions.